AD9300 데이터 시트보기 (PDF) - Analog Devices
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AD9300 Datasheet PDF : 8 Pages
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AD9300
AD9300 BURN-IN DIAGRAM
SUGGESTED LAYOUT OF AD9300
PC BOARD
FUNCTIONAL DESCRIPTION
IN1–IN4
Four analog input channels.
GROUND
Analog input shielding grounds, not internally con-
nected. Connect each to external low-impedance
ground as close to device as possible.
A0
One of two TTL decode control lines required for
channel selection. See Logic Truth Table.
A1
One of two TTL decode control lines required for
channel selection. See Logic Truth Table.
ENABLE
TTL-compatible chip enable. In enabled mode
(logic HIGH), output signal tracks selected input
channel; in disabled mode (logic LOW), output is
high impedance and no signal appears at output.
–VS
Negative supply voltage; normally –10 V dc to
–15 V dc.
+VS
Positive supply voltage; normally +10 V dc to
+15 V dc.
OUTPUT
Analog output. Tracks selected input channel when
enabled.
BYPASS
Bypass terminal for internal bias line; must be
decoupled externally to ground through 0.1 µF
capacitor.
GROUND
RETURN
Analog signal and power supply ground return.
METALIZATION PHOTOGRAPH
MECHANICAL INFORMATION
Die Dimensions . . . . . . . . . . . . . . . . . 84 × 104 × 18 (max) mils
Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . 4 × 4 (min) mils
Metalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Aluminum
Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None
Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –VS
Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Oxynitride
Die Attach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gold Eutectic
Bond Wire . . . . . . . . 1.25 mil, Aluminum; Ultrasonic Bonding
or 1 mil, Gold; Gold Ball Bonding
AD9300 Timing Diagram
LOGIC TRUTH TABLE
ENABLE
0
1
1
1
1
A1 A0
XX
00
01
10
11
OUTPUT
High Z
IN1
IN2
IN3
IN4
–4–
REV. A
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