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ADG601BRT 데이터 시트보기 (PDF) - Analog Devices

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ADG601BRT
ADI
Analog Devices ADI
ADG601BRT Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
ADG601/ADG602
ABSOLUTE MAXIMUM RATINGS1
(TA = 25°C unless otherwise noted)
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6.5 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –6.5 V
Analog Inputs2 . . . . . . . . . . . . . . . . . VSS –0.3 V to VDD +0.3 V
Digital Inputs2 . . . . . . . . . . . . . . . . . . . . –0.3 V to VDD +0.3 V
or 30 mA, whichever occurs first
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 100 mA
Peak Current, S or D
(Pulsed at 1 ms, 10% Duty Cycle Max) . . . . . . . . . 200 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Micro-SOIC Package
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 206°C/W
θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 44°C/W
SOT_23 Package
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . 229.6°C/W
θJC Thermal Impedance . . . . . . . . . . . . . . . . . . 91.99°C/W
Lead Temperature, Soldering (10 seconds) . . . . . . . . . 300°C
IR Reflow, Peak Temperature . . . . . . . . . . . . . . . . . . . 220°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
PIN CONFIGURATIONS
6-Lead Plastic Surface Mount (SOT_23)
(RT-6)
VDD 1
S2
8 IN
ADG601/
ADG602
7D
VSS 3 TOP VIEW 6 GND
(Not to Scale)
8-Lead Small Outline Micro-SOIC
(RM-8)
D1
8S
NC 2 ADG601/ 7 GND
ADG602
NC 3 TOP VIEW 6 IN
VDD 4 (Not to Scale) 5 VSS
NC = NO CONNECT
ORDERING GUIDE
Model
Temperature Range Package Description
Package Option
ADG601BRT
ADG601BRM
ADG602BRT
ADG602BRM
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Plastic Surface-Mount (SOT_23)
Micro Small Outline (Micro-SOIC)
Plastic Surface-Mount (SOT_23)
Micro Small Outline (Micro-SOIC)
RT-6
RM-8
RT-6
RM-8
*Branding on SOT_23 and Micro-SOIC packages is limited to three characters due to space constraints.
Branding Information*
STB
STB
SUB
SUB
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADG601/ADG602 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–4–
REV. 0

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