BDW47(2004) 데이터 시트보기 (PDF) - ON Semiconductor
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BDW47 Datasheet PDF : 8 Pages
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BDW42* − NPN, BDW46,
BDW47* − PNP
Preferred Device
Darlington Complementary
Silicon Power Transistors
This series of plastic, medium−power silicon NPN and PNP
Darlington transistors are designed for general purpose and low speed
switching applications.
Features
• Pb−Free Package is Available**
• High DC Current Gain − hFE = 2500 (typ) @ IC = 5.0 Adc.
• Collector Emitter Sustaining Voltage @ 30 mAdc:
VCEO(sus) = 80 Vdc (min) − BDW46
100 Vdc (min.) − BDW42/BDW47
• Low Collector Emitter Saturation Voltage
VCE(sat) = 2.0 Vdc (max) @ IC = 5.0 Adc
3.0 Vdc (max) @ IC = 10.0 Adc
• Monolithic Construction with Built−In Base Emitter Shunt resistors
• TO−220AB Compact Package
MAXIMUM RATINGS
Rating
Symbol Value
Unit
Collector-Emitter Voltage
VCEO
Vdc
BDW46
80
BDW42, BDW47
100
Collector-Base Voltage
VCB
Vdc
BDW46
80
BDW42, BDW47
100
Emitter-Base Voltage
Collector Current
Base Current
Total Device Dissipation
@ TC = 25°C
Derate above 25°C
VEB
5.0
Vdc
IC
15
Adc
IB
0.5
Adc
PD
85
W
0.68
W/°C
Operating and Storage Junction
Temperature Range
TJ, Tstg −55 to
°C
+150
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Symbol Max
Unit
Thermal Resistance,
Junction−to−Case
RqJC
1.47
°C/W
http://onsemi.com
15 A DARLINGTON
COMPLEMENTARY SILICON
POWER TRANSISTORS
80−100 V, 85 W
1
2
3
MARKING
DIAGRAM
4
TO−220AB
CASE 221A
STYLE 1
BDWxx
YYWW
xx = 42, 46 or 47
YY = Year
WW = Work Week
ORDERING INFORMATION
Device
Package
Shipping†
BDW42
TO−220AB
50 Units/Rail
BDW46
TO−220AB
50 Units/Rail
BDW47
TO−220AB
50 Units/Rail
BDW47G
TO−220AB
(Pb−Free)
50 Units/Rail
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*Preferred devices are ON Semiconductor recommended
choices for future use and best overall value
**For additional information on our Pb−Free strategy and soldering details,
please download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2004
June, 2004 − Rev. 11
Publication Order Number:
BDW42/D
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