BGY885A 데이터 시트보기 (PDF) - NXP Semiconductors.
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BGY885A Datasheet PDF : 11 Pages
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NXP Semiconductors
6. Package outline
BGY885A
860 MHz, 18.5 dB push-pull amplifier
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads
D
E
Z
p
SOT115J
A2
L
c
d
U2
Q
B
p
A
F
S
yM B
123
5
789
W
e
b
wM
e1
q2
yM B
q1
xM B
U1
q
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A2
max.
b
c
D
max.
d
E
max.
e
e1
F
L
min.
p
Q
max.
q
q1 q2 S
U1 U2 W
w
x
y
Z
max.
mm 20.8
9.5
0.51
0.38
0.25
27.2
2.04
2.54
13.75
2.54
5.08 12.7
8.8
4.15
3.85
2.4
38.1 25.4 10.2 4.2 44.75
44.25
8.2
7.8
6-32 0.25
UNC
0.7
0.1
3.8
OUTLINE
VERSION
IEC
SOT115J
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
04-02-04
10-06-18
Fig 1. Package outline SOT115J
BGY885A
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 19 September 2011
© NXP B.V. 2011. All rights reserved.
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