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FDS6609A 데이터 시트보기 (PDF) - Fairchild Semiconductor

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FDS6609A
Fairchild
Fairchild Semiconductor Fairchild
FDS6609A Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
Electrical Characteristics
Symbol
Parameter
TA = 25°C unless otherwise noted
Test Conditions
Min Typ Max Units
Off Characteristics
BV DSS
BV DSS
TJ
IDSS
Drain–Source Breakdown Voltage VGS = 0 V, ID = -250 µA
-30
Breakdown Voltage Temperature
Coefficient
ID = -250 µA, Referenced to 25°C
-22
Zero Gate Voltage Drain Current VDS = -24 V, VGS = 0 V
V
mV/°C
-1
µA
IGSSF
Gate–Body Leakage, Forward
VGS = 20 V, VDS = 0 V
100 nA
IGSSR
Gate–Body Leakage, Reverse
VGS = -20 V VDS = 0 V
–100 nA
On Characteristics (Note 2)
V GS(th)
Gate Threshold Voltage
V GS(th)
TJ
Gate Threshold Voltage
Temperature Coefficient
RDS(on)
Static Drain–Source
On–Resistance
ID(on)
On–State Drain Current
gFS
Forward Transconductance
VDS = VGS, ID = –250 µA
–1 –1.5 –3
V
ID = –250 µA, Referenced to 25°C
4
mV/°C
VGS = –10 V, ID = –7.0 A
VGS = –4.5 V, ID = –5.5 A
VGS = –10 V, ID = –7.0A, TJ=125°C
0.027 0.032
0.04 0.05
0.04 0.54
VGS = –10 V, VDS = –5 V
–20
A
VDS = –10 V, ID = –7.0 A
14.5
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS = –15 V,
f = 1.0 MHz
V GS = 0 V,
930
pF
278
pF
114
pF
Switching Characteristics
td(on)
Turn–On Delay Time
tr
Turn–On Rise Time
td(off)
Turn–Off Delay Time
tf
Turn–Off Fall Time
Qg
Total Gate Charge
Qgs
Gate–Source Charge
Qgd
Gate–Drain Charge
(Note 2)
VDD = –15 V, ID = –1 A,
VGS = –10 V, RGEN = 6
VDS = –15 V, ID = –7.2 A,
VGS = –10 V
12 21
ns
11 20
ns
33 52
ns
13 23
ns
18 29
nC
2.5
nC
4.1
nC
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
V SD
Drain–Source Diode Forward
Voltage
VGS = 0 V, IS = –2.1 A (Note 2)
–2.1 A
–0.76 –1.2 V
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while Rθ CA is determined by the user's board design.
a) 50°/W when
mounted on a 1in2
pad of 2 oz copper
b) 105°/W when
mounted on a .04 in2
pad of 2 oz copper
c) 125°/W when mounted on a
minimum pad.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
FDS6609A Rev B(W)

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