H11B815.W 데이터 시트보기 (PDF) - Fairchild Semiconductor

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H11B815.W

4-Pin Photodarlington Optocoupler

Fairchild Semiconductor 

Package Dimensions (Through Hole) Package Dimensions (0.4" Lead Spacing)

0.270 (6.86)

0.250 (6.35)

0.270 (6.86)

0.250 (6.35)

0.190 (4.83)

0.175 (4.45)

0.200 (5.08)

0.115 (2.92)

0.270 (6.86)

0.250 (6.35)

0.154 (3.90)

0.120 (3.05)

0.100 (2.54)

TYP

0.020 (0.51)

MIN

15°

0.300 (7.62)

typ

0.190 (4.83)

0.175 (4.45)

0.200 (5.08)

0.115 (2.92)

0.270 (6.86)

0.250 (6.35)

0.016 (0.40)

0.008 (0.20)

0.154 (3.90)

0.120 (3.05)

0.004 (0.10)

MIN

0.100 (2.54)

TYP

0.400 (10.16)

TYP

0 to 15°

0.016 (0.40)

0.008 (0.20)

Package Dimensions (Surface Mount)

PCB Footprint Layout

0.270 (6.86)

0.250 (6.35)

0.190 (4.83)

0.175 (4.45)

0.300 (7.62)

TYP

0.200 (5.08)

0.115 (2.92)

0.070 (1.78)

0.045 (1.14)

0.020 (0.51)

MIN

0.100 (2.54)

TYP

0.022 (0.56)

0.016 (0.41)

Lead Coplanarity 0.004 (0.10) MAX

0.315 (8.00)

MIN

0.405 (10.30)

MAX

NOTE

All dimensions are in inches (millimeters)

0.016 (0.40)

0.008 (0.20)

0.295 (7.49)

0.415 (10.54)

0.070 (1.78)

0.060 (1.52)

0.100 (2.54)

0.030 (0.76)

6

www.fairchildsemi.com

H11B815 Rev. 1.0.1

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