SIHFP23N50L-E3(2011) 데이터 시트보기 (PDF) - Vishay Semiconductors
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SIHFP23N50L-E3 Datasheet PDF : 11 Pages
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VERSION 2: FACILITY CODE = Y
B
3 R/2
4
E
E/2 S
Q
2xR
(2)
D
12
3
5 L1
C
L
2 x b2
3xb
2x e
b4
0.10 M C A M
Lead Assignments
1. Gate
2. Drain
3. Source
4. Drain
See view B
Package Information
Vishay Siliconix
A
A2
A
4
D
A
7 ØP
Ø k M DBM
D2
(Datum B)
ØP1
4
D1
4
Thermal pad
A
C
A1
D DE E
CC
View B
Planting
4
E1
0.01 M D B M
View A - A
(b1, b3, b5)
Base metal
(c)
c1
(b, b2, b4)
(4)
Section C - C, D - D, E - E
DIM.
A
A1
A2
b
b1
b2
b3
b4
b5
c
c1
D
D1
MILLIMETERS
MIN.
MAX.
4.58
5.31
2.21
2.59
1.17
2.49
0.99
1.40
0.99
1.35
1.53
2.39
1.65
2.37
2.42
3.43
2.59
3.38
0.38
0.86
0.38
0.76
19.71
20.82
13.08
-
NOTES
DIM.
D2
E
E1
e
Øk
L
L1
ØP
Ø P1
Q
R
S
MILLIMETERS
MIN.
MAX.
0.51
1.30
15.29
15.87
13.72
-
5.46 BSC
0.254
14.20
16.25
3.71
4.29
3.51
3.66
-
7.39
5.31
5.69
4.52
5.49
5.51 BSC
NOTES
Notes
(1) Dimensioning and tolerancing per ASME Y14.5M-1994
(2) Contour of slot optional
(3) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outermost extremes of the plastic body
(4) Thermal pad contour optional with dimensions D1 and E1
(5) Lead finish uncontrolled in L1
(6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154")
(7) Outline conforms to JEDEC outline TO-247 with exception of dimension c
Revision: 19-Oct-2020
2
Document Number: 91360
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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