MC100EL16DTR2G 데이터 시트보기 (PDF) - ON Semiconductor

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MC100EL16DTR2G

5.0 VECL Differential Receiver

ON Semiconductor 

MC10EL16, MC100EL16

Table 1. PIN DESCRIPTION

PIN

FUNCTION

D, D

Q, Q

VBB

VCC

VEE

NC

EP

ECL Data Inputs

ECL Data Outputs

Reference Voltage Output

Positive Supply

Negative Supply

No Connect

Exposed pad must be connected to a sufficient thermal conduit.

Electrically connect to the most negative supply or leave floating

open.

Table 2. ATTRIBUTES

Characteristics

Internal Input Pulldown Resistor

Internal Input Pullup Resistor

ESD Protection

Human Body Model

Machine Model

Charge Device Model

Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)

Flammability Rating

Oxygen Index: 28 to 34

Transistor Count

Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

1. For additional information, see Application Note AND8003/D.

Value

75 KW

N/A

> 500 V

> 100 V

> 2 KV

Level 1

UL 94 V−0 @ 0.125 in

47

Table 3. MAXIMUM RATINGS

Symbol

Parameter

Condition 1

Condition 2

Rating

Units

VCC

PECL Mode Power Supply

VEE

NECL Mode Power Supply

VI

PECL Mode Input Voltage

NECL Mode Input Voltage

VEE = 0 V

VCC = 0 V

VEE = 0 V

VCC = 0 V

VI  VCC

VI  VEE

8

V

−8

V

6

V

−6

V

Iout

Output Current

Continuous

Surge

50

mA

100

mA

IBB

VBB Sink/Source

TA

Operating Temperature Range

Tstg

Storage Temperature Range

qJA

Thermal Resistance (Junction−to−Ambient) 0 lfpm

500 lfpm

SOIC−8

SOIC−8

± 0.5

−40 to +85

−65 to +150

190

130

mA

°C

°C

°C/W

°C/W

qJC

Thermal Resistance (Junction−to−Case)

Standard Board

SOIC−8

qJA

Thermal Resistance (Junction−to−Ambient) 0 lfpm

500lfpm

TSSOP−8

TSSOP−8

41 to 44

185

140

°C/W

°C/W

°C/W

qJC

Thermal Resistance (Junction−to−Case)

Standard Board

TSSOP−8

qJA

Thermal Resistance (Junction−to−Ambient) 0 lfpm

500 lfpm

DFN8

DFN8

41 to 44 ± 5%

129

84

°C/W

°C/W

°C/W

Tsol

Wave Solder

Pb <2 to 3 sec @ 248°C

Pb−Free <2 to 3 sec @ 260°C

265

°C

265

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

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