RF3320 데이터 시트보기 (PDF) - RF Micro Devices
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RF3320 Datasheet PDF : 18 Pages
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Preliminary
RF3320
Evaluation Board Schematic
VCC
J1
1 NC
CS 2 CS
SDA 3 SDA
SCLK 4 SCLK
J5-1 5 SHDNB
J3-1 6 TXEN
7 NC
R1
100 kΩ
8 NC
9 NC
10 VCC
11 NC
12
13 NC
J3
J2
1
J1-6
TXEN
1
VCC
2
2
3
3 GND
J5
J4
1
J1-5
SHDNB
1
VCC
2
2
3
3 GND
1
VCC
VCC1
VCC2
L2 (Ferrite)
30 Ω
L3 (Ferrite)
30 Ω
L4 (Ferrite)
30 Ω
L1 (Ferrite)
30 Ω
C2
+ C1
1 nF
10 µF
(10 V)
JP1
1 VCC
2 GND
3
16
R2
100 kΩ
14 NC
15 VCC
16 NC
17 NC
18 GND
19 GND
J6
RF IN
2
R3
75 Ω
C3
3
T1
1 nF
1:1
4
Power
Control
15
14
13
C7
15 pF
T2
R5
4:1 24 Ω
VCC2
J7
RF OUT
20 GND
21 GND
22 GND
23 GND
24 GND
25 GND
VCC1
5
R4
C4
75 Ω 1 nF
6
7
C5
0.1 µF
8
C6
220 pF
12
11
Gain Control
and Serial Bus
10
9
PACKAGE BASE
C8
15 pF
C9
100 pF
SDA
CS
Notes:
1. 4-layer board.
2. Underside of package must solder to ground.
3. Place C5 and C6 as close to pin as possible.
4. C1 is tantalum, size code Y.
5. All other components are 0603 size.
6. Replace R5 with 0 Ω resistor if 75 Ω connector is used.
3320400B
SCLK
PCB Layout Considerations
The RF3320 Evaluation board can be used as a guide for the layout in your application. Care should be taken in laying
out the RF3320 in other applications. The RF3320 will have similar results if the following guidelines are taken into con-
sideration:
• Make sure underside of package is soldered to a good ground on the PCB.
• Keep input and output traces as short as possible.
• Ensure a good ground plane by using multiple vias to the ground plane.
• Use a low noise power supply along with decoupling capacitors.
Rev A10 010514
3-33
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