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SB520 데이터 시트보기 (PDF) - Cystech Electonics Corp.

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SB520
CYSTEKEC
Cystech Electonics Corp. CYSTEKEC
SB520 Datasheet PDF : 3 Pages
1 2 3
CYStech Electronics Corp.
DO-201AD Dimension
Spec. No. : C762LD
Issued Date : 2009.05.15
Revised Date :
Page No. : 3/3
DO-201AD Molded Plastic Package
CYStek Package Code: LD
DIM
Inches
Min. Max.
Millimeters
Min. Max.
A ϕ0.048 ϕ0.052 ϕ1.20 ϕ1.30
B 1.000
-
25.40
-
C 0.285 0.375 7.20 9.50
DIM
Inches
Min. Max.
Millimeters
Min. Max.
D 1.000
-
25.40
-
E ϕ0.190 ϕ0.210 ϕ4.80 ϕ5.30
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
Lead : Axial leads, solderable per MIL-STD-750, Method 2026 guaranteed.
Mold Compound : Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SB520 thru SB560
CYStek Product Specification

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