SPM0103ND3-3 데이터 시트보기 (PDF) - Unspecified

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SPM0103ND3-3

Amplified Mini Surface Mount Silicon Microphone

Unspecified 

SPM0103ND3

11. SOLDER REFLOW PROFILE

170–180°C

230°C

Pre-heat

120 sec.

Solder Melt

100 sec.

260°C

Stage

Pre-heat

Solder Melt

Peak

Temperature Profile

170 ~ 180 C

Above 230 C

260 C maximum

Time (maximum)

120 sec.

100 sec.

30 sec.

Notes:

1.

Do not pull a vacuum over the port hole of the microphone. Pulling a

vacuum over the port hole can damage the device.

2.

Do not board wash after the reflow process. Board washing and

cleaning agents can damage the device. Do not expose to ultrasonic

processing or cleaning.

3.

Number of Reflow = recommend no more than 3 cycles.

12. ADDITIONAL NOTES

(A) Packaging (reference SiSonic_Packaging_Spec.pdf)

(B) Shelf life: Twelve (12) months when devices are to be stored in factory supplied, unopened

ESD moisture sensitive bag under maximum environmental conditions of 30ºC, 70% R.H.

(C) Exposure: Devices should not be exposed to high humidity, high temperature environment.

MSL (moisture sensitivity level) Class 2A.

(D) Out of bag: Maximum of 90 days out of ESD moisture sensitive bag, assuming maximum

conditions of 30ºC/70% R.H.

Knowles Acoustics,

a division of Knowles Electronics, LLC.

Revision: C

8 of 10

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