SPT7610 데이터 시트보기 (PDF) - Cadeka Microcircuits LLC.
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SPT7610 Datasheet PDF : 10 Pages
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THERMAL MANAGEMENT
Adequate heat sinking and air flow must be provided to
keep the die temperature below +150 °C. This device is
packaged with the cavity up (the die is on the bottom of
the package). Therefore, CADEKA recommends that the
device be heat sinked by contacting the bottom of the
package through a hole in the circuit board.
The thermal coefficients of the SPT7610 (44L cerquad)
are as follows:
θja = +78 °C/W (junction to ambient in
still air with no heat sink)
θjc = +4 °C/W (junction to case)
SUBCIRCUIT SCHEMATICS
Figure 3A – Input Circuit
AGND
Figure 3B – Output Circuit
AGND
DGND
Figure 3C – Clock Input
AGND
VIN
Vr
CLK
Data Out
CLK
AVEE
AVEE
SPT7610
8
1/21/02
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