HMC324MS8G(V01) 데이터 시트보기 (PDF) - Hittite Microwave
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HMC324MS8G Datasheet PDF : 6 Pages
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MICROWAVE CORPORATION
v01.0701
HMC324MS8G
GaAs InGaP HBT MMIC DUAL DRIVER
AMPLIFIER, DC - 3.0 GHz
Evaluation PCB for HMC324MS8G
1
The circuit board used in the final application should use RF circuit design techniques. Signal lines should have 50
ohm impedance while the package ground leads and exposed paddle should be connected directly to the ground plane
similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes.
The evaluation circuit board shown is available from Hittite upon request.
Evaluation Circuit Board Layout Design Details
Item
Description
J1 - J4
PC Mount SMA Connector
U1
HMC324MS8G
PCB*
104221 Evaluation PCB 1.5" x 1.5"
* Circuit Board Material: Rogers 4350
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Visit us at www.hittite.com, or Email at sales@hittite.com
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