Z2K800-RN-10 데이터 시트보기 (PDF) - Superworld Electronics

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Z2K800-RN-10

FERRITE CHIP BEADS

Superworld Electronics 

FERRITE CHIP BEADS

Z2 SERIES

8. SOLDERING AND MOUNTING :

8-1. Recommended PC Board Pattern

2.60

0.60

PC board should be designed so that products can prevent damage from

mechanical stress when warping the board.

8-2. Soldering

Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering

cannot be avoided, the preferred technique is the utilization of hot air soldering tools.

Note.

If wave soldering is used ,there will be some risk.

Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk

8-2.1 Lead Free Solder Re-flow :

Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C)

8-2.2 Soldering Iron :

Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a

soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.

Note :

a) Preheat circuit and products to 150° C.

d) 1.0mm tip diameter (max)

b) 350° C tip temperature for Ferrite chip bead (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm

c) Never contact the ceramic with the iron tip

f) Limit soldering time to 4-5 secs.

P rehe ating

TP(26 0° C/40 s max.)

S olde ring

20~40s

Natu ral

cooling

217

200

150

60~150s

60~180s

4 80s max.

25

Time(sec.)

Figure 1. Re-flow Soldering:3 times max

P rehe ating

350

S olde ring

Natu ral

cooling

150

O ve r 60s.

G rad ual

Cooling

Within4 ~5s

Figure 2. Wave Soldering:1 times max

NOTE : Specifications subject to change without notice. Please check our website for latest information.

19.01.2015

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 5

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