HCPL-257K-200 데이터 시트보기 (PDF) - HP => Agilent Technologies

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HCPL-257K-200

Hermetically Sealed, Transistor Output Optocouplers for Analog and Digital Applications

HP => Agilent Technologies 

Hermetic Optocoupler Options

Option

100

Description

Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This

option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below

for details).

4.32 (0.170)

MAX.

0.51 (0.020)

MIN.

2.29 (0.090)

2.79 (0.110)

1.14 (0.045)

1.40 (0.055)

0.51 (0.020)

MAX.

4.32 (0.170)

MAX.

0.51 (0.020)

MIN.

2.29 (0.090)

2.79 (0.110)

1.14 (0.045)

1.40 (0.055)

0.51 (0.020)

MAX.

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

0.20 (0.008)

0.33 (0.013)

7.36 (0.290)

7.87 (0.310)

200 Lead finish is solder dipped rather than gold plated. This option is available on commercial

and hi-rel product in 8 and 16 pin DIP. DESC drawing part numbers contain provisions for

lead finish. All leadless chip carrier devices are delivered with solder dipped terminals as a

standard feature.

300 Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This

option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below

for details). This option has solder dipped leads.

0.51 (0.020)

MIN.

2.29 (0.090)

2.79 (0.110)

5.57 (0.180)

MAX.

1.40 (0.055)

1.65 (0.065)

0.51 (0.020)

MAX.

5.57 (0.180)

MAX.

0.51 (0.020)

MIN.

2.29 (0.090)

2.79 (0.110)

1.40 (0.055)

1.65 (0.065)

0.51 (0.020)

MAX.

5° MAX.

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

0.20 (0.008)

0.33 (0.013)

9.65 (0.380)

9.91 (0.390)

5.57 (0.180)

MAX.

1-563

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