EL7155CS-T13 데이터 시트보기 (PDF) - Elantec -> Intersil

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EL7155CS-T13

High Performance Pin Driver

Elantec -> Intersil 

EL7156C

High Performance Pin Driver

power dissipation for a given application prior to select-

ing the package type.

Power dissipation may be calculated:

PD

=

(VS

×

IS )

+

(CINT

×

VS2

×

f)

+

(CL

×

VO

U

2

T

×

f)

where:

• VS is the total power supply to the EL7156C (from

VS+ to GND),

• Vout is the swing on the output (VH - VL),

• CL is the load capacitance,

• CINT is the internal load capacitance (50pF max.),

• IS is the quiescent supply current (3mA max.) and

• f is frequency

Having obtained the application’s power dissipation, a

maximum package thermal coefficient may be deter-

mined, to maintain the internal die temperature below

Tjmax:

θja

=

T----j--m----a--x----–-----T----m---a---x-

PD

where:

• Tjmax is the maximum junction temperature (125°C),

• Tmax is the maximum operating temperature,

• PD is the power dissipation calculated above,

• θja thermal resistance on junction to ambient.

θja is 160°C/W for the SO8 package and 100°C/W for

the PDIP8 package when using a standard JEDEC

JESD51-3 single-layer test board. If Tjmax is greater than

125°C when calculated using the equation above, then

one of the following actions must be taken:

• Reduce θja the system by designing more heat-sinking

into the PCB (as compared to the standard JEDEC

JESD51-3)

• Use the PDIP8 instead of the SO8 package

• De-rate the application either by reducing the switch-

ing frequency, the capacitive load, or the maximum

operating (ambient) temperature (Tmax)

9

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