AH3 데이터 시트보기 (PDF) - WJ Communications => Triquint

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AH3

High Dynamic Range Gain Block

WJ Communications => Triquint 

AH3

High Dynamic Range Gain Block

The Communications Edge TM

Product Information

AH3-G Mechanical Information

This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded

(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.

Outline Drawing

Product Marking

The AH3-G will be marked with an “AH3G”

designator. An alphanumeric lot code

(“XXXX-X”) is also marked below the part

designator on the top surface of the package.

The obsolete tin-lead package is marked with

“AH3” designator followed by alphanumeric

lot code.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

MSL / ESD Rating

Land Pattern

ESD Rating: Class 1B

Value:

Passes 500V to <1000V

Test:

Human Body Model (HBM)

Standard: JEDEC Standard JESD22-A114

ESD Rating: Class IV

Value:

Passes 1000V to <2000V

Test:

Charged Device Model (CDM)

Standard: JEDEC Standard JESD22-C101

MSL Rating: Level 3 at +260 °C convection reflow

Standard: JEDEC Standard J-STD-020

Thermal Specifications

Parameter

Operating Case Temperature

Thermal Resistance, Rth (1)

Junction Temperature, Tj (2)

Rating

-40 to +85 °C

59 °C / W

129 °C

1. The thermal resistance is referenced from the hottest

part of the junction to the ground tab (pin 4).

2. This corresponds to the typical biasing condition of

+5V, 150 mA at an 85°C case temperature. A

minimum MTTF of 1 million hours is achieved for

junction temperatures below 160 °C.

1000

100

10

1

60

MTTF vs. GND Tab Temperature

70 80 90 100

Tab Temperature (°C)

Mounting Config. Notes

1. Ground / thermal vias are critical for the proper

performance of this device. Vias should use a .35mm

(#80 / .0135”) diameter drill and have a final plated thru

diameter of .25 mm (.010”).

2. Add as much copper as possible to inner and outer layers

near the part to ensure optimal thermal performance.

3. Mounting screws can be added near the part to fasten the

board to a heatsink. Ensure that the ground / thermal via

region contacts the heatsink.

4. Do not put solder mask on the backside of the PC board in

the region where the board contacts the heatsink.

5. RF trace width depends upon the PC board material and

construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are in

degrees.

110

Specifications and information are subject to change without notice.

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com

Page 4 of 4 April 2006

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