RF2301
Pin Function Description
Interface Schematic
1
GND
Low inductance ground connections. Use individual vias to backside
ground plane, placed within 0.030" of pin landing for optimum perfor-
mance.
2
GND
Same as pin 1.
3
RF IN
DC-coupled RF input. A broadband impedance match is produced by
internal shunt resistive feedback. The DC level is 0V. If a DC voltage is
present from connected circuitry, an external DC-blocking capacitor is
required for the proper DC operating point.
4
GND
Same as pin 1.
5
GND
Same as pin 1.
6
RF OUT Open drain RF output. A broadband impedance match is produced by
an external 100Ω resistor to power supply as shown in Application
Schematic 1. Approximately 3dB improvement in gain and output
VDD1
VDD2
4
power can be obtained over at least a 20% bandwidth by replacing the
resistor to power supply with an external chip inductor network as
RF IN
shown in Application Schematic 2. An external DC-blocking capacitor is
RF OUT
required if the following circuitry is not DC-blocked.
7
VDD2
Power supply connections. Bypass with external chip capacitor and
individual via to backside ground plane.
8
VDD1
Power supply connections. Bypass with external chip capacitor and
individual via to backside ground plane.
Rev A8 010717
4-39