CXG1131ER 데이터 시트보기 (PDF) - Sony Semiconductor

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CXG1131ER

High Power 3 × 5 Antenna Switch MMIC with Integrated Control Logic

Sony Semiconductor 

Package Outline

Unit: mm

CXG1131ER

24PIN VQFN(PLASTIC)

4.0

3.6

C

18

13

0.9 ± 0.1

0.7

0.05 S

A 19

12 B

PIN 1 INDEX

24

7

1

6

0.4

x4

0.6

S

C

0.2 S A-B C

x4

0.2 S A-B C

0.05 M S A-B C

0.6 ± 0.1

4.78

(0.39)

45˚

1.0

(0.15)

SONY CODE

EIAJ CODE

JEDEC CODE

VQFN-24P-03

Solder Plating

0.13 ± 0.025

+ 0.09

0.14 – 0.03

TERMINAL SECTION

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

COPPER ALLOY

PACKAGE MASS

0.04g

LEAD PLATING SPECIFICATIONS

ITEM

LEAD MATERIAL

SOLDER COMPOSITION

PLATING THICKNESS

SPEC.

COPPER ALLOY

Sn-Bi Bi:1-4wt%

5-18µm

–7–

Sony Corporation

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