ACTS240DTR 데이터 시트보기 (PDF) - Intersil

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ACTS240DTR

High Reliability, Radiation Hardened Octal Buffer/Line Driver, Three-State, Inverting

Intersil 

Die Characteristics

DIE DIMENSIONS:

(2540µm x 2540µm x 533µm ±51µm)

100 x 100 x 21mils ±2mil

METALLIZATION:

Type: Al Si Cu

Thickness: 10.0kÅ ±2kÅ

SUBSTRATE POTENTIAL:

Unbiased (Silicon on Sapphire)

Bond Pad #20 (VCC) First

Bond Pad #10 (Gnd) Uses Two Bond Wires

Bond Pad #20 (VCC) Uses Two Bond Wires

Metallization Mask Layout

AI1 AEN

(2) (1)

ACTS240T

BACKSIDE FINISH:

Sapphire

PASSIVATION:

Type: Silox (SiO2)

Thickness: 8.0kÅ ±1.0kÅ

WORST CASE CURRENT DENSITY:

< 2.0e5 A/cm2

TRANSISTOR COUNT:

164

PROCESS:

CMOS SOS

ACTS240T

VCC VCC

(20) (20)

BEN

(19)

BO4 (3)

AI2 (4)

BO3 (5)

AI3 (6)

BO2 (7)

AI4 (8)

BO1 (9)

(10) (10)

GND GND

(18) AO1

(17) BI4

(16) AO2

(15) BI3

(14) AO3

(13) BI2

AO4 (12)

(11)

BI1

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