MC10H181 데이터 시트보기 (PDF) - ON Semiconductor
부품명
상세내역
제조사
MC10H181 Datasheet PDF : 8 Pages
| |||
MC10H181
PACKAGE DIMENSIONS
CDIP–24
L SUFFIX
CERAMIC DIP PACKAGE
CASE 758–02
ISSUE A
B
L
P
24
13
1
12
–A–
G
D 24 PL
0.25 (0.010) M T A M
–A–
24
1
–T–
SEATING
PLANE
E
G
F
J
N
C
K
–T–
SEATING
PLANE
F
PDIP–24
P SUFFIX
PLASTIC DIP PACKAGE
CASE 724–03
ISSUE D
13
–B–
12
L
C
K
N
D 24 PL
0.25 (0.010) M T A M
NOTE 1
M
J 24 PL
0.25 (0.010) M T B M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
INCHES
DIM MIN MAX
A 1.240 1.285
B 0.285 0.305
C 0.160 0.200
D 0.015 0.021
F 0.045 0.062
G 0.100 BSC
J 0.008 0.013
K 0.100 0.165
L 0.300 0.310
N 0.020 0.050
P 0.360 0.400
MILLIMETERS
MIN MAX
31.50 32.64
7.24 7.75
4.07 5.08
0.38 0.53
1.14 1.57
2.54 BSC
0.20 0.33
2.54 4.19
7.62 7.87
0.51 1.27
9.14 10.16
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 1.230 1.265 31.25 32.13
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.020 0.38 0.51
E
0.050 BSC
1.27 BSC
F 0.040 0.060 1.02 1.52
G 0.100 BSC
2.54 BSC
J 0.007 0.012 0.18 0.30
K 0.110 0.140 2.80 3.55
L
0.300 BSC
7.62 BSC
M 0_ 15_ 0_ 15_
N 0.020 0.040 0.51 1.01
http://onsemi.com
6
Share Link: 