HA-2539_03 데이터 시트보기 (PDF) - Intersil

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HA-2539_03

600MHz, Very High Slew Rate Operational Amplifier

Intersil 

HA-2539

Die Characteristics

DIE DIMENSIONS:

62 mils x 76 mils x 19 mils

1575µm x 1930µm x 483µm

METALLIZATION:

Type: Al, 1% Cu

Thickness: 16kÅ ±2kÅ

PASSIVATION:

Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos.)

Silox Thickness: 12kÅ ±2kÅ

Nitride Thickness: 3.5kÅ ±1.5kÅ

Metallization Mask Layout

SUBSTRATE POTENTIAL (POWERED UP):

V-

TRANSISTOR COUNT:

30

PROCESS:

Bipolar Dielectric Isolation

+IN

V-

OUTPUT

V+

-IN

9

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