HI-200/883 데이터 시트보기 (PDF) - Intersil
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HI-200/883 Datasheet PDF : 11 Pages
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Die Characteristics
DIE DIMENSIONS:
54 mils x 79mils x 19 mils
METALLIZATION:
Type: Aluminum
Thickness: 16kÅ ±2kÅ
GLASSIVATION:
Type: Nitride over Silox
Silox Thickness: 12kÅ ±2kÅ
Nitride Thickness: 3.5kÅ ±1kÅ
Metallization Mask Layout
GND
2
IN 2 3
HI-200/883
DIE ATTACH:
Material: Gold/Silicon Eutectic Alloy
Temperature: Ceramic DIP - 460°C (Max)
Temperature: Metal Can - 420°C (Max)
WORST CASE CURRENT DENSITY:
2 x 105 A/cm2 at 25mA
HI-200
A2
A1
1
10
V+
9
8
IN 1
OUT 2
4
5
V-
11
6
7
OUT 1
VREF
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