SPF-3043 데이터 시트보기 (PDF) - Stanford Microdevices
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SPF-3043 Datasheet PDF : 3 Pages
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Absolute Maximum Ratings
Parameter
Drain Current
Forward Gate Current
Drain-to-Source Voltage
Gate-to-Source Voltage
RF Input Power
Operating Temperature
Storage Temperature Range
Power Dissipation
Operating Junction Temperature
Symbol
IDS
IGS
VDS
VGS
PIN
TOP
Tstor
PDISS
TJ
Value
150
2
7
-3
15
-40 to +85
-40 to +150
430
+150
Unit
mA
mA
V
V
dBm
C
C
mW
C
Caution: ESD sensitive
Appropriate precautions in handling, packaging and
testing devices must be observed.
Preliminary
SPF-3043 Low Noise pHEMT GaAs FET
Part Number Ordering Information
Part Number
Reel Size
Devices/Reel
SPF-3043
7"
3000
Part Symbolization
The part will be symbolized with an “F3” and a
Pin 1 indicator on the top surface of the package.
Pin Description
Pin #
1
2
3
4
Function
Gate
GND & Source
Drain
GND & Source
Description
RF Input
Connection to ground. Use via holes to reduce lead
inductance. Place vias as close to ground leads as possible.
RF Output
Same as Pin 2
4
3
D
e
e
Package Dimensions
1
2
L
HE CL
A2
F3
E
CL
b
b1
Q1
C
A
A1
NOTE:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONS ARE INCLUSIVE OF PLATING.
3. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH
& METAL BURR.
4. ALL SPECIFICATIONS COMPLY TO EIAJ SC70.
5. DIE IS FACING UP FOR MOLD AND FACING DOWN
FOR TRIM/FORM. ie :REVERSE TRIM/FORM.
6. PACKAGE SURFACE TO BE MIRROR FINISH.
SYMBOL
E
D
HE
A
A2
A1
Q1
e
b
b1
c
L
MIN
MAX
1.15
1.35
1.85
2.25
1.80
2.40
0.80
1.10
0.80
1.00
0.00
0.10
0.10
0.40
0.65 BSC
0.25
0.40
0.55
0.70
0.10
0.18
0.10
0.30
Use multiple plated-through vias holes located close to the package pins to ensure a good RF ground connection to a
continuous groundplane on the backside of the board.
726 Palomar Ave., Sunnyvale, CA 94085
Phone: (800) SMI-MMIC
3
http://www.stanfordmicro.com
EDS-101772 Rev. A
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