SMBJ54A-HRA 데이터 시트보기 (PDF) - Littelfuse, Inc
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SMBJ54A-HRA Datasheet PDF : 6 Pages
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Transient Voltage Suppression Diodes
Surface Mount – 600W > SMBJ-HRA series
Soldering Parameters TVS Diode Arrays (SPA™Family of Products)
Reflow Condition
Lead–free assembly
- Temperature Min (Ts(min))
Pre Heat - Temperature Max (Ts(max))
- Time (min to max) (ts)
Average ramp up rate (Liquidus Temp (TL)
to peak
TS(max) to TL - Ramp-up Rate
Reflow
- Temperature (TL) (Liquidus)
- Time (min to max) (ts)
Peak Temperature (TP)
Time within 5°C of actual peak
Temperature (tp)
Ramp-down Rate
Time 25°C to peak Temperature (TP)
Do not exceed
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
280°C
Physical Specifications
Weight
Case
Polarity
Terminal
0.003 ounce, 0.093 grams
JEDEC DO214AA. Molded plastic body
over glass passivated junction
Color band denotes cathode except
Bidirectional
Matte Tin-plated leads, Solderable per
JESD22-B102
TP
TL
Ts(max)
Ts(min)
25˚C
Ramp-up
tp
tL
Critical Zone
TL to TP
ts
Preheat
Ramp-down
t 25˚C to Peak
Time (t)
Environmental Specifications
High Temp. Storage
HTRB
Temperature Cycling
MSL
H3TRB
RSH
JESD22-A103
JESD22-A108
JESD22-A104
JEDEC-J-STD-020, Level 1
JESD22-A101
JESD22-B106
Dimensions
DO-214AA (SMB J-Bend)
Cathode Band
(for Uni-directional products only)
A
C
D
E
J
B
H
F
G
K
L
I
©2014 Littelfuse, Inc.Solder Pads
Specifications are s(uablljedcimt teoncshioangseinwmithmo)ut notice.
Revised: 05/08/14
Dimensions
A
B
C
D
E
F
G
H
I
J
K
L
Inches
Min
Max
0.077
0.086
0.160
0.180
0.130
0.155
0.084
0.096
0.030
0.060
-
0.008
0.205
0.220
0.006
0.012
0.089
-
0.085
-
-
0.107
0.085
-
Millimeters
Min
Max
1.950
2.200
4.060
4.570
3.300
3.940
2.130
2.440
0.760
1.520
-
0.203
5.210
5.590
0.152
0.305
2.260
-
2.160
-
-
2.740
2.160
-
94
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