MAX17605(2017) 데이터 시트보기 (PDF) - Maxim Integrated

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MAX17605
(Rev.:2017)

4A Sink/Source Current, 12ns, Dual MOSFET Drivers

Maxim Integrated 

MAX17600–MAX17605

4A Sink/Source Current,

12ns, Dual MOSFET Drivers

Absolute Maximum Ratings

VDD, INA, INB, ENA, ENB to GND........................-0.3V to +16V

OUTA, OUTB to GND............................................-0.3V to +16V

Junction Operating Temperature Range........... -40°C to +125°C

Continuous Power Dissipation (TA = +70°C)

8-Pin TDFN (derate 23.8mW/°C above +70°C).........1904mW

8-Pin SO (derate 74mW/°C above +70°C).............. 588.2mW*

8-Pin µMAX (derate 12.9mW/°C above +70°C)......1030.9mW

*As per JEDEC 51 standard.

Operating Temperature Range.......................... -40°C to +125°C

Junction Temperature.......................................................+150°C

Storage Temperature Range............................. -65°C to +150°C

Lead Temperature (soldering, 10s).................................. +300°C

Soldering Temperature (reflow)........................................+240°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Information

PACKAGE TYPE: 8 TDFN

Package Code

Outline Number

Land Pattern Number

THERMAL RESISTANCE, FOUR-LAYER BOARD

Junction to Ambient (θJA)

Junction to Case (θJC)

T833+2

21-0137

90-0059

42°C/W

8°C/W

PACKAGE TYPE: 8 SO

Package Code

Outline Number

Land Pattern Number

THERMAL RESISTANCE, FOUR-LAYER BOARD

Junction to Ambient (θJA)

Junction to Case (θJC)

S8+2

21-0041

90-0096

136°C/W

38°C/W

PACKAGE TYPE: 8 µMAX

Package Code

Outline Number

Land Pattern Number

THERMAL RESISTANCE, FOUR-LAYER BOARD

Junction to Ambient (θJA)

Junction to Case (θJC)

U8E+2

21-0107

90-0145

77.6°C/W

5°C/W

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,

“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing

pertains to the package regardless of RoHS status.

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.

For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

www.maximintegrated.com

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