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AU80610006225AASLBXC 데이터 시트보기 (PDF) - Intel

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AU80610006225AASLBXC Datasheet PDF : 80 Pages
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Introduction
1.2
System Memory Features
DDR2 (D410, D510, D425, and D525)
— One channel of DDR2 memory (consists of 64 data lines):
„ Maximum of two DIMMs per channel, containing single or double-sided DIMM
— Memory DDR2 data transfer rates of 667 and 800 MT/s
— Only non-ECC DIMMs are supported
— Support unbuffered DIMMs
— I/O Voltage of 1.8V for DDR2
— Supports 512-Mb, 1-Gb & 2-Gb technologies for DDR2
— Support 4 banks for 512 Mbit densities for DDR2
— Support 8 banks for 1-Gb and 2-Gb densities for DDR2
— Support 2 DIMMs, 4 GB (assuming 2-Gb density device technology) maximum
— Support up to 32 simultaneous open pages per channel (assuming 4 ranks of
8i devices)
— Support Partial Writes to memory using Data Mask signals (DM)
— Enhances Address Mapping
— Support DIMM page size of 4KB and 8KB
— Support data burst length of 8 for all memory configurations
— Support memory thermal management scheme to selectively manage reads
and/or writes. Memory thermal management can be triggered by either on-die
thermal sensor, or by preset limits. Management limits are determined by
weighted sum of various commands that are scheduled on the memory
interface.
DDR3 SO-DIMM only (D525 and D425)
— Support for DDR3 at data transfer rate of 800 MT/s only
— One channel of DDR3 memory (consists of 64-bit data lines); maximum of
2 SO-DIMMs in Raw Card A or Raw Card B format
— I/O Voltage of 1.5 V for DDR3
— Maximum of 4GB memory capacity supported
— Memory organizations supported (refer to Platform Design Guide for more
details)
2 SO-DIMM
1 SO-DIMM
Datasheet
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