BCX51,135(2008) 데이터 시트보기 (PDF) - NXP Semiconductors.
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BCX51,135 Datasheet PDF : 15 Pages
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NXP Semiconductors
BC636; BCP51; BCX51
45 V, 1 A PNP medium power transistors
6. Thermal characteristics
Table 7.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
BC636
BCP51
Conditions
in free air
BCX51
Rth(j-sp)
thermal resistance from
junction to solder point
BC636
BCP51
BCX51
Min Typ Max Unit
[1] -
-
150 K/W
[1] -
-
190 K/W
[2] -
-
125 K/W
[1] -
-
230 K/W
[2] -
-
135 K/W
[3] -
-
95
K/W
-
-
40
K/W
-
-
17
K/W
-
-
20
K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
103
Zth(j-a)
(K / W)
102
duty cycle =
1
0.75
0.5
0.33
0.2
0.1
10 0.05
0.02
0.01
10
006aaa222
10−1
10−5
10−4
10−3
10−2
10−1
1
10
102
103
tp (s)
FR4 PCB, standard footprint
Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT54;
typical values
BC636_BCP51_BCX51_8
Product data sheet
Rev. 08 — 22 February 2008
© NXP B.V. 2008. All rights reserved.
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