AD7175-2 데이터 시트보기 (PDF) - Analog Devices

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AD7175-2

24-Bit, 250 kSPS, Sigma-Delta ADC with 20 µs Settling and True Rail-to-Rail Buffers

Analog Devices 

Data Sheet

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 3.

Parameter

AVDD1, AVDD2 to AVSS

AVDD1 to DGND

IOVDD to DGND

IOVDD to AVSS

AVSS to DGND

Analog Input Voltage to AVSS

Reference Input Voltage to AVSS

Digital Input Voltage to DGND

Digital Output Voltage to DGND

Analog Input/Digital Input Current

Operating Temperature Range

Storage Temperature Range

Maximum Junction Temperature

Lead Soldering, Reflow Temperature

ESD Rating (HBM)

Rating

−0.3 V to +6.5 V

−0.3 V to +6.5 V

−0.3 V to +6.5 V

−0.3 V to +7.5 V

−3.25 V to +0.3 V

−0.3 V to AVDD1 + 0.3 V

−0.3 V to AVDD1 + 0.3 V

−0.3 V to IOVDD + 0.3 V

−0.3 V to IOVDD + 0.3 V

10 mA

−40°C to +105°C

−65°C to +150°C

150°C

260°C

4 kV

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

AD7175-2

THERMAL RESISTANCE

θJA is specified for a device soldered on a JEDEC test board for

surface-mount packages.

Table 4. Thermal Resistance

Package Type

24-Lead TSSOP

JEDEC 1-Layer Board

JEDEC 2-Layer Board

θJA

Unit

149

°C/W

81

°C/W

ESD CAUTION

Rev. B | Page 9 of 62

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