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STP10N65K3(2012) 데이터 시트보기 (PDF) - STMicroelectronics

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STP10N65K3 Datasheet PDF : 17 Pages
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STF10N65K3, STFI10N65K3, STP10N65K3
Electrical characteristics
Table 6. Switching times
Symbol
Parameter
td(on)
tr
td(off)
tf
Turn-on delay time
Rise time
Turn-off-delay time
Fall time
Test conditions
VDD = 310 V, ID = 3.5 A,
RG = 4.7 Ω, VGS = 10 V
(see Figure 17)
Min. Typ. Max Unit
14.5
ns
14
-
44
ns
-
ns
35
ns
Table 7.
Symbol
Source drain diode
Parameter
Test conditions
ISD
ISDM (1)
VSD (2)
Source-drain current
Source-drain current (pulsed)
Forward on voltage
ISD = 7 A, VGS = 0
trr
Qrr
IRRM
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD = 7 A, di/dt = 100A/µs
VDD = 60 V (see Figure 22)
trr
Qrr
IRRM
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD = 7 A, di/dt = 100 A/µs
VDD = 60 V, Tj = 150 °C
(see Figure 22)
1. Pulse width limited by safe operating area.
2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%
Min. Typ. Max. Unit
7.2 A
-
28.8 A
-
1.5 V
320
ns
-
2
µC
13
A
410
ns
- 2.9
µC
14
A
Table 8. Gate-source Zener diode
Symbol
Parameter
Test conditions
V(BR)GSO
Gate-source breakdown
voltage
Igs=± 1 mA, ID=0
Min. Typ. Max. Unit
30 -
-V
The built-in back-to-back Zener diodes have been specifically designed to enhance not only
the device’s ESD capability, but also to make them capable of safely absorbing any voltage
transients that may occasionally be applied from gate to source. In this respect, the Zener
voltage is appropriate to achieve efficient and cost-effective protection of device integrity.
The integrated Zener diodes thus eliminate the need for external components.
Doc ID 15732 Rev 3
5/17

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