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10XSD200 데이터 시트보기 (PDF) - Freescale Semiconductor

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10XSD200
Freescale
Freescale Semiconductor Freescale
10XSD200 Datasheet PDF : 60 Pages
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ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings (continued)
All voltages are relative to ground unless mentioned otherwise. Exceeding these ratings may cause permanent damage.
Parameter
Symbol
Maximum ratings
Unit
THERMAL RATINGS
Operating Temperature (8)
Ambient
Junction
C
TA
- 40 to 125
TJ
- 40 to 150
Storage Temperature
TSTG
- 55 to 150
C
Thermal Resistance Junction to Case Bottom/ VPWR Flag Surface
Peak package reflow temperature during reflow(9),(10)
RJC
TPPRT
0.22
Note 10
C/ W
C
Notes:
8. To achieve high reliability over 10 years of continuous operation, the device's continuous operating junction temperature should not
exceed 125 °C.
9. Pin soldering temperature limit is for 40 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
10. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
Analog Integrated Circuit Device Data
Freescale Semiconductor
10XSD200
7

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