RHC2512FTR100 데이터 시트보기 (PDF) - Unspecified
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RHC2512FTR100 Datasheet PDF : 7 Pages
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RHC Series
High Power Thick Film Chip Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
Recommended Pad Layout
Type / Code
RHC2512
L
Total Length
0.315
8.00
W
Total Width
0.138
3.50
D
Pad Depth
0.118
3.00
Unit
inches
mm
Recommended Solder Profile
This information is intended as a reference for solder profiles for Stackpole resistive components. These profiles should
be compatible with most soldering processes. These are only recommendations. Actual numbers will depend on board
density, geometry, packages used, etc., especially those cells labeled with “*”.
100% Matte Tin / RoHS Compliant Terminations
Soldering iron recommended temperatures: 330°C to 350°C with minimum duration.
Maximum number of reflow cycles: 3.
Wave Soldering
Description
Maximum
Recommended
Preheat Time
80 seconds
70 seconds
Temperature Diff.
140°C
120°C
Solder Temp.
260°C
250°C
Dwell Time at Max.
10 seconds
5 seconds
Ramp DN (°C/sec)
N/A
N/A
Temperature Diff. = Defference between final preheat stage and soldering stage.
Minimum
60 seconds
100°C
240°C
*
N/A
Description
Ramp Up (°C/sec)
Dwell Time > 217°C
Solder Temp.
Dwell Time at Max.
Ramp DN (°C/sec)
Convection IR Reflow
Maximum
3°C/sec
150 seconds
260°C
30 seconds
6°C/sec
Recommended
2°C/sec
90 seconds
245°C
15 seconds
3°C/sec
Minimum
*
60 seconds
*
10 seconds
*
Rev Date: 11/18/2020
2
This specification may be changed at any time without prior notice
Please confirm technical specifications before you order and/or use.
www.seielect.com
marketing@seielect.com
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