MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSOT−23, 5 LEAD
CASE 419AE−01
ISSUE O
DATE 19 DEC 2008
D
e
E1 E
TOP VIEW
SYMBOL
A
A1
A2
b
c
D
E
E1
e
L
L1
L2
θ
MIN
0.01
0.80
0.30
0.12
0.30
0º
NOM
0.05
0.87
0.15
2.90 BSC
2.80 BSC
1.60 BSC
0.95 TYP
0.40
0.60 REF
0.25 BSC
MAX
1.00
0.10
0.90
0.45
0.20
0.50
8º
A2 A
b
A1
SIDE VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-193.
q
L
L1
END VIEW
c L2
DOCUMENT NUMBER: 98AON34392E
Electronic versions are uncontrolled except when
STATUS: ON SEMICONDUCTOR STANDARD
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
REFERENCE:
© Semiconductor Components Industries, LLC, 2002
October, D20E0S2C−RRIePvT. I0ON: TSOT−23, 5 LEAD
“CONTROLLED COPY” in red.
http://onsemi.com
1
Case Outline Number:
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