CAT24M01(2018) 데이터 시트보기 (PDF) - ON Semiconductor

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CAT24M01
(Rev.:2018)

EEPROM Serial 1-Mb I2C

ON Semiconductor 

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

SCALE 4:1

UDFN8 3.0x2.0, 0.5P

CASE 517BU−01

ISSUE O

D

AB

ÍÍÍ PIN 1

REFERENCE

ÍÍÍÍÍÍ 0.15 C

0.15 C TOP VIEW

0.05 C

DETAIL A

0.05 C

NOTE 4

A1

SIDE VIEW

(0.065)

E

(0.127)

DETAIL A

A

C

SEATING

PLANE

DATE 06 APR 2011

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSIONS b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.25 MM FROM TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

MILLIMETERS

DIM MIN MAX

A 0.45 0.55

A1 0.00 0.05

b 0.20 0.30

D

2.00 BSC

D2 1.35 1.45

E

3.00 BSC

E2 0.85 0.95

e

0.50 BSC

L 0.35 0.45

GENERIC

MARKING DIAGRAM*

D2

1

4

0.10 M C A B

8X L

0.10 M C A B

E2

8

5

e

BOTTOM VIEW

8X b

0.10 M C A B

0.05 M C D NOTE 3

RECOMMENDED

MOUNTING FOOTPRINT

1.56

XXX

ALL

YM

G

XXX = Specific Device Code

A = Assembly Location Code

LL = Assembly Lot

Y = Year

M = Month

G = Pb−Free Package

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “ G”,

may or may not be present.

8X 0.63

PKG

OUTLINE

1.06

3.30

1

0.50

PITCH

8X

0.32

DIMENSIONS: MILLIMETERS

DOCUMENT NUMBER: 98AON55336E

Electronic versions are uncontrolled except when

STATUS: ON SEMICONDUCTOR STANDARD

accessed directly from the Document Repository. Printed

versions are uncontrolled except when stamped

NEW STANDARD:

“CONTROLLED COPY” in red.

© Semiconductor Components Industries, LLC, 2002

http://onsemi.com

October, 2D0E0S2 C− ReIPv.T0ION: UDFN8 3.0 X 2.0, 0.5P

1

Case Outline Number:

PAGE 1 OFX2XX

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