EMIF06-MSD02N16 데이터 시트보기 (PDF) - STMicroelectronics

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EMIF06-MSD02N16

ESD Suppressors 6-line Micro QFN Lvl 4 20pF 50MHz

STMicroelectronics 

EMIF06-MSD02N16

Recommendation on PCB assembly

4

Recommendation on PCB assembly

4.1

Stencil opening design

1. General recommendation on stencil opening design

a. Stencil opening dimensions: L (Length), W (Width), T (Thickness).

2. General design rule

a. Stencil thickness (T) = 75 ~ 125 μm

b.

Aspect

ratio

=

W

T

≥

1.5

c.

Aspect

area

=

L×W

2T L + W

≥ 0.66

3. Reference design

a. Stencil opening thickness: 100 μm

b. Stencil opening for central exposed pad: Opening to footprint ratio is 50%.

c. Stencil opening for leads: Opening to footprint ratio is 90%

Figure 16. Stencil opening dimensions

L

TW

Figure 17. Recommended stencil window position

5µm

5µm

15 µm

300 µm

350 µm

190 µm

200 µm

2800 µm

15 µm

1.6

0 .70

50 µm

2100 µm

50 µm

350 µm

3.00

2.30

0.40

0.30

0.45

0.20

Footprint

Stencil window

Footprint

DS5979 - Rev 2

page 10/14

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