EMIF06-MSD02N16 데이터 시트보기 (PDF) - STMicroelectronics
부품명
상세내역
제조사
EMIF06-MSD02N16 Datasheet PDF : 14 Pages
| |||
EMIF06-MSD02N16
Solder paste
4.2
Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed.
4. Solder paste with fine particles: powder particle size is 20-45 μm.
4.3
Placement
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering
3. Standard tolerance of ±0.05 mm is recommended.
4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste
and cause solder joints to short. Too low placement force can lead to insufficient contact between package
and solder paste that could cause open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be performed with a high
resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder
paste printing, pick and place and reflow soldering by using optimized tools.
4.4
PCB design preference
1. To control the solder paste amount, the closed via is recommended instead of open vias.
2. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is
recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away.
4.5
Reflow profile
Figure 18. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Temperature (°C)
250
200
150
100
0.9 °C/s
50
240-245 °C
2 - 3 °C/s
60 sec
(90 max)
-2 °C/s
-3 °C/s
-6 °C/s
Time (s)
0 30 60 90 120 150 180 210 240 270 300
Note:
Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile
corresponds to the latest IPC/JEDEC J-STD-020.
DS5979 - Rev 2
page 11/14
Share Link: 