1PMT4099DE3/TR7 데이터 시트보기 (PDF) - Microsemi Corporation
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1PMT4099DE3/TR7 Datasheet PDF : 4 Pages
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SCOTTSDALE DIVISION
1PMT4614e3 thru 1PMT4627e3,
1PMT4099e3 thru 1PMT4135e3
POWERMITETM
Low Noise 1 Watt Zener Diodes
DESCRIPTION
This Microsemi Powermite® surface mount low noise Zener package series
provides a higher power handling capability that are also RoHS compliant.
In addition to its size advantages, Powermite® package features include a
full-metallic bottom that eliminates the possibility of solder flux entrapment
during assembly, and a unique locking tab acts as an efficient heat path
from die to mounting plane for external heat sinking with very low thermal
resistance junction to case (bottom). Its innovative design makes this
device ideal for use with automatic insertion equipment.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
APPEARANCE
DO-216
FEATURES
• Surface mount equivalent to JEDEC registered
1N4099 thru 1N4135 and 1N4614 thru 1N4627
series except with additional power capability
• Extensive selection from 1.8 to 100 V
• Regulates voltage over a broad operating current and
temperature range
• Low noise density (1-3 kHz) at test current
• Low reverse leakage current
• RoHS compliant
APPLICATIONS / BENEFITS
• Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively
• Moisture classification Level 1 per IPC/JEDEC
J-STD-020B with no dry pack required
• Nonsensitive to ESD per MIL-STD-750 Method 1020
• Compatible with automatic insertion equipment
• Full metallic bottom eliminates flux entrapment
MAXIMUM RATINGS
• Operating and Storage Temperatures: -55°C to +150°C
• Steady-State Power: 1.0 watt at TC < 120oC where
TC is case bottom temperature at mounting plane, or
0.5 watts at TA = 30ºC (ambient temperature) when
mounted on FR4 PC board as described for thermal
resistance (also see power deratings in Figure 1)
• Thermal Resistance: 30°C/W junction to case
(bottom) and 240°C/W junction to ambient on FR4
PC board (1 oz copper) with recommended footprint
(see last page)
• Forward voltage: 1.1 Volts @ 200 mA
• Solder Temperatures: 260°C for 10 s (max)
MECHANICAL AND PACKAGING
• CASE: Void-free transfer molded thermosetting epoxy
compound meeting UL94V-0
• FINISH: Annealed matte-Tin plating over copper and
readily solderable per MIL-STD-750 method 2026
(consult factory for Tin-Lead plating)
• POLARITY: Cathode designated by Tab 1 (bottom)
• MARKING: Three numerical digits of P/N and a dot
(see next page listing)
• WEIGHT: 0.016 grams (approx.)
• Package dimensions on last page
• Tape & Reel option: Standard per EIA-481-B
3000 on 7 inch reel and 12,000 on 13” reel
Copyright © 2007
10-15-2007 REV J
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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