MC33926(2014) 데이터 시트보기 (PDF) - Freescale Semiconductor

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MC33926
(Rev.:2014)

5.0 A Throttle Control H-Bridge

Freescale Semiconductor 

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 3. Maximum Ratings (continued)

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device. These parameters are not production tested.

Symbol

Ratings

Value

Unit

Notes

TPPRT

RJC

Peak Package Reflow Temperature During Reflow

Approximate Junction-to-Case Thermal Resistance

250

< 1.0

°C

C/W

(7) (8)

(9)

Notes

7. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

8. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C for Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL),

9. Exposed heatsink pad plus the power and ground pins comprise the main heat conduction paths. The actual RJB (junction-to-PC board)

values will vary depending on solder thickness and composition and copper trace thickness and area. Maximum current at maximum die

temperature represents ~16 W of conduction loss heating in the diagonal pair of output MOSFETs. Therefore, the RJA must be 

< 5.0 C/W for maximum current at 70 C ambient. Module thermal design must be planned accordingly.

Analog Integrated Circuit Device Data

Freescale Semiconductor

33926

7

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