Package Dimensions
unit : mm
LC72722PMS
SOIC24 W / MFP24 (375 mil)
CASE 751CF
ISSUE A
to
SOLDERING FOOTPRINT*
(Unit: mm)
1.27
0.52
NOTE: The measurements are not to guarantee but for reference only.
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
GENERIC
MARKING DIAGRAM*
XXXXXXXXXX
YMDDD
XXXXX = Specific Device Code
Y = Year
M = Month
DDD = Additional Traceability Data
*This information is generic.
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