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SMCJ1.5KE100A 데이터 시트보기 (PDF) - Micro Commercial Components

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SMCJ1.5KE100A
MCC
Micro Commercial Components MCC
SMCJ1.5KE100A Datasheet PDF : 6 Pages
1 2 3 4 5 6
MCC
TM
Micro Commercial Components
SMCJ1.5KE6.8(C)A
  omponents
20736 Marilla Street Chatsworth
THRU

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SMCJ1.5KE550(C)A
Features
For surface mount applicationsin in or der to optimize board space
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Low profile package
Fast response time: typical less than 1.0ps from 0 volts to
VBR minimum
Halogen free available upon request by adding suffix "-HF"
Low inductance
Excellent clamping capability
UL Recognized File # E331408
Mechanical Data
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Terminals: solderable per MIL-STD-750, Method 2026
Polarity: Color band denotesposit ive end (cathode)
except Bidirectional
Maximum soldering temperature: 260oC for 10 seconds
Maximum Ratings @ 25oC Unless Otherwise Specified
Peak Pulse Current on
10/1000us waveform
IPP See Table 1 Note: 2
Peak Pulse Power
PPP
Dissipation
Operation And Storage TJ, TSTG
Temperature Range
1500W
-55oC to
+175oC
Note: 2
3
Typical Thermal
Resistance Junction
to Lead
RthJL
15oC/W
Typical Thermal
Resistance Junction
to Ambient
RthJA
75 OC/W
Transient
Voltage Suppressor
6.8 to 550 Volts
1500 Watt
DO-214AB
(SMC) (LEAD FRAME)
G
H
D
A
C
E
F
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.079
.103
B
.108
.128
C
.002
.008
D
.006
.012
E
.030
.060
F
..305
.320
G
.260
.280
H
.220
.245
MM
MIN
2.00
2.75
0.051
0.152
0.76
7.75
6.60
5.59
B
MAX
2.62
3.25
0.203
0.305
1.52
8.13
7.11
6.22
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.190
NOTES:
1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
2. Non-repetitive current pulse, per Fig.3 and derated above
TA=25oC per Fig.2.
3. Mounted on 8.0mm2 copper pads to each terminal.
0.125”
0.070”
Revision: F
www.mccsemi.com
1 of 5
2014/03/07

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