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FP1208 데이터 시트보기 (PDF) - Unspecified

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FP1208 Datasheet PDF : 4 Pages
1 2 3 4
Technical Data 10148
Effective June 2017

Part
Number 8
FP1208R1-R15-R
FP1208R1-R18-R
FP1208R1-R21-R
FP1208R1-R23-R
FP1208R1-R25-R
OCL 1
(nH)±10%
150
180
210
230
250
FLL min. 2
(nH)
114
137
160
176
191
Product Specifications
Irms 3
(Amps)
Isat 1 4
(Amps)
Isat 2 5
(Amps)
85
79
72
66
50
65
57
61
53
55
48
Isat 3 6
(Amps)
72
63
55
50
44
DCR
(mΩ) @ 20°C
0.29±5%
K-factor 7
283
283
283
283
283
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc@25°C
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1
3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of
other heat generating components will affect the temperature rise. It is recommended that the
temperature of the part not exceed 125°C under worst case operating conditions verified in
the end application.
4. Isat1: Peak current for approximately 20% rolloff @ 25°C
5. Isat2: Peak current for approximately 20% rolloff @ 85°C
6. Isat3: Peak current for approximately 20% rolloff @ 125°C
7. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L
* ∆I * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH),
∆I (Peak to peak ripple current in Amps).
8. Part Number Definition: FP1208Rx-Rxx-R:
- FP1208= Product code and size
- Rx= DCR indicator
- Rxx= Inductance value in µH
- “-R” suffix = RoHS compliant
Dimensions- mm
DCR measured from point “a” to point “b”
Part marking: 1208Rx (Rx= DCR indicator), Rxx = Inductance value in uH (R= decimal point) wwllyy= date
code, r= revision level
Tolerances are +/- 0.15 millimeters unless stated otherwise.
PCB tolerances are +/- 0.10 millimeters unless stated otherwise.
All soldering surfaces to be be coplanar within 0.1 millimeters.
Packaging information - mm
Supplied in tape and reel packaging, 500 parts on a 13” diameter reel.
2
www.eaton.com/electronics

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