NLAS44599(2005) 데이터 시트보기 (PDF) - ON Semiconductor
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NLAS44599 Datasheet PDF : 12 Pages
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NLAS44599
PACKAGE DIMENSIONS
QFN−16
MN SUFFIX
CASE 485G−01
ISSUE B
D
A
B
ÎÎÎÎÎÎ PIN 1
LOCATION
E
0.15 C
0.15 C
TOP VIEW
0.10 C
16 X 0.08 C
(A3)
SIDE VIEW
A
SEATING
PLANE
A1
C
16X L
NOTE 5
16X K
D2
e
5
8
EXPOSED PAD
4
9
E2
e
1
12
16
13
16X b
0.10 C A B BOTTOM VIEW
0.05 C NOTE 3
0.575
0.022
3.25
0.128
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. Lmax CONDITION CAN NOT VIOLATE 0.2 MM
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
MILLIMETERS
DIM MIN MAX
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.18 0.30
D 3.00 BSC
D2 1.65 1.85
E 3.00 BSC
E2 1.65 1.85
e 0.50 BSC
K 0.20 −−−
L 0.30 0.50
SOLDERING FOOTPRINT
3.25
0.128
0.30
0.012
EXPOSED PAD
1.50
0.059
0.30
0.50
0.012
ǒ Ǔ 0.02
SCALE 10:1
mm
inches
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