VSMB2020X01 데이터 시트보기 (PDF) - Vishay Semiconductors

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VSMB2020X01

High Speed Infrared Emitting Diodes, 940 nm, GaAlAs, DH

Vishay Semiconductors 

www.vishay.com

SOLDER PROFILE

300

250

255 °C

240 °C

217 °C

200

150

max. 120 s

100

max. 260 °C

245 °C

max. 30 s

max. 100 s

50 max. ramp up 3 °C/s max. ramp down 6 °C/s

0

0

50 100 150 200 250 300

19841

Time (s)

Fig. 9 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020

PACKAGE DIMENSIONS in millimeters: VSMB2000

0.4

VSMB2000X01, VSMB2020X01

Vishay Semiconductors

DRYPACK

Devices are packed in moisture barrier bags (MBB) to

prevent the products from moisture absorption during

transportation and storage. Each bag contains a desiccant.

FLOOR LIFE

Floor life (time between soldering and removing from MBB)

must not exceed the time indicated on MBB label:

Floor life: 4 weeks

Conditions: Tamb < 30 °C, RH < 60 %

Moisture sensitivity level 2a, acc. to J-STD-020.

DRYING

In case of moisture absorption devices should be baked

before soldering. Conditions see J-STD-020 or label.

Devices taped on reel dry using recommended conditions

192 h at 40 °C (+ 5 °C), RH < 5 %.

Ø 1.8 ± 0.1

Z

2.2

5.8 ± 0.2

2.3 ± 0.2

2.2

Z 20:1

exposed copper

1.1 ± 0.1

Cathode

1.7

Pin ID

Anode

Solder pad proposal

acc. IPC 7351

Ø 2.3 ± 0.1

6.7

technical drawings

according to DIN

specifications

Not indicated tolerances ± 0.1

Drawing-No.: 6.544-5391.02-4

Issue: 2; 18.03.10

21517

Rev. 1.5, 23-Aug-11

4

Document Number: 81930

For technical questions, contact: emittertechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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