TEMD7100X01 데이터 시트보기 (PDF) - Vishay Semiconductors

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TEMD7100X01

Silicon PIN Photodiode

Vishay Semiconductors 

www.vishay.com

REFLOW SOLDER PROFILE

300

250

255 °C

240 °C

217 °C

200

150

max. 120 s

100

max. 260 °C

245 °C

max. 30 s

max. 100 s

50 max. ramp up 3 °C/s max. ramp down 6 °C/s

0

0

19841

50 100 150 200 250 300

Time (s)

Fig. 8 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020

PACKAGE DIMENSIONS in millimeters

TEMD7100X01

Vishay Semiconductors

DRYPACK

Devices are packed in moisture barrier bags (MBB) to

prevent the products from moisture absorption during

transportation and storage. Each bag contains a desiccant.

FLOOR LIFE

Floor life (time between soldering and removing from MBB)

must not exceed the time indicated on MBB label:

Floor life: 168 h

Conditions: Tamb < 30 °C, RH < 60 %

Moisture sensitivity level 3, acc. to J-STD-020.

DRYING

In case of moisture absorption devices should be baked

before soldering. Conditions see J-STD-020 or label.

Devices taped on reel dry using recommended conditions

192 h at 40 °C (+ 5 °C), RH < 5 %.

20018

Rev. 1.3, 18-Oct-11

4

Document Number: 81960

For technical questions, contact: detectortechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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