S34ML01G200BFI000(2012) 데이터 시트보기 (PDF) - Spansion Inc.
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S34ML01G200BFI000 Datasheet PDF : 68 Pages
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Data Sheet (Advance Information)
1.2 Connection Diagram
Figure 1.2 48-Pin TSOP1 Contact x8 Device
NC 1
NC
NC
NC
NC
NC
R/B#
RE#
CE#
NC
NC
VCC 12
VSS 13
NC
NC
CLE
ALE
WE#
WP#
NC
NC
NC
NC
NC 24
NAND Flash
TSOP1
(x8)
48 VSS (1)
NC
NC
NC
I/O7
I/O6
I/O5
I/O4
NC
VCC (1)
NC
37 VCC
36 VSS
NC
VCC (1)
NC
I/O3
I/O2
I/O1
I/O0
NC
NC
NC
25 VSS (1)
Note:
1. These pins should be connected to power supply or ground (as designated) following the ONFI specification, however they might not be
bonded internally.
Figure 1.3 63-FBGA Contact, x8 Device (Top View)
A1
A2
NC
NC
A9
A10
NC
NC
B1
B9
B10
NC
NC
NC
C3
C4
C5
C6
C7
C8
WP#
ALE
VSS
CE#
WE#
RB#
D3
D4
D5
D6
D7
D8
VCC (1) RE#
CLE
NC
NC
NC
E3
E4
E5
E6
E7
E8
NC
NC
NC
NC
NC
NC
F3
F4
F5
F6
F7
F8
NC
NC
NC
NC
VSS (1)
NC
G3
G4
G5
G6
G7
G8
NC
VCC (1)
NC
NC
NC
NC
H3
H4
H5
H6
H7
H8
NC
I/O0
NC
NC
NC
Vcc
J3
J4
J5
J6
J7
J8
NC
I/O1
NC
VCC
I/O5
I/O7
K3
K4
K5
K6
K7
K8
VSS
I/O2
I/O3
I/O4
I/O6
VSS
L1
L2
NC
NC
L9
L10
NC
NC
M1
M2
NC
NC
M9
M10
NC
NC
Note:
1. These pins should be connected to power supply or ground (as designated) following the ONFI specification, however they might not be
bonded internally.
August 3, 2012 S34ML01G2_04G2_01
Spansion® SLC NAND Flash Memory for Embedded
11
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