AM29LV800BB-80DGC2 데이터 시트보기 (PDF) - Advanced Micro Devices
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AM29LV800BB-80DGC2
Advanced Micro Devices
| AM29LV800BB-80DGC2 Datasheet PDF : 0 Pages | |||
SUPPLEMENT
PAD DESCRIPTION
Pads relative to die center.
Pad
Signal
Pad Center (mils)
X
Y
Pad Center (millimeters)
X
Y
1
VCC
–0.90
127.50
–0.02
3.24
2
DQ4
–13.00
127.50
–0.33
3.24
3
DQ12
–18.90
127.50
–0.48
3.24
4
DQ5
–24.80
127.50
–0.63
3.24
5
DQ13
–30.70
127.50
–0.78
3.24
6
DQ6
–36.50
127.50
–0.93
3.24
7
DQ14
–42.40
127.50
–1.08
3.24
8
DQ7
–48.30
127.50
–1.23
3.24
9
DQ15/A–1
–54.20
127.50
–1.38
3.24
10
VSS
–63.60
125.90
–1.62
3.20
11
BYTE#
–63.60
115.80
–1.62
2.94
12
A16
–63.60
105.70
–1.62
2.68
13
A15
–63.30
–126.00
–1.61
–3.20
14
A14
–57.40
–126.00
–1.46
–3.20
15
A13
–52.00
–126.00
–1.32
–3.20
16
A12
–46.20
–126.00
–1.17
–3.20
17
A11
–40.70
–126.00
–1.03
–3.20
18
A10
–34.90
–126.00
–0.89
–3.20
19
A9
–29.50
–125.80
–0.75
–3.20
20
A8
–23.60
–126.00
–0.60
–3.20
21
WE#
–18.10
–126.00
–0.46
–3.20
22
RESET#
–8.60
–129.80
–0.22
–3.30
23
RY/BY#
8.70
–129.80
0.22
–3.30
24
A18
18.20
–126.00
0.46
–3.20
25
A17
23.70
–126.00
0.60
–3.20
26
A7
29.50
–126.00
0.75
–3.20
27
A6
34.90
–126.00
0.89
–3.20
28
A5
40.70
–126.00
1.03
–3.20
29
A4
46.20
–126.00
1.17
–3.20
30
A3
52.00
–126.00
1.32
–3.20
31
A2
57.40
–126.00
1.46
–3.20
32
A1
63.30
–126.00
1.61
–3.20
33
A0
63.60
105.50
1.62
2.68
34
CE#
63.60
115.60
1.62
2.94
35
VSS
63.60
125.70
1.62
3.19
36
OE#
54.20
129.60
1.38
3.29
37
DQ0
46.60
127.50
1.18
3.24
38
DQ8
40.70
127.50
1.03
3.24
39
DQ1
34.90
127.50
0.89
3.24
40
DQ9
28.90
127.50
0.73
3.24
41
DQ2
23.10
127.50
0.59
3.24
42
DQ10
17.20
127.50
0.44
3.24
43
DQ3
11.40
127.50
0.29
3.24
44
DQ11
5.40
127.50
0.14
3.24
Note: The coordinates above are relative to the die center and can be used to operate wire bonding equipment.
4
Am29LV800B Known Good Die
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