TS7221AIYLT 데이터 시트보기 (PDF) - STMicroelectronics
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TS7221AIYLT Datasheet PDF : 11 Pages
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TS7221
3
Package information
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK® packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
Figure 15. SOT23-5L package mechanical data
Dimensions
Ref.
Millimeters
Min.
Typ.
Max.
Min.
A
0.90
1.45
35.4
A1
0.00
0.15
0.00
A2
0.90
1.30
35.4
b
0.35
0.50
13.7
C
0.09
0.20
3.5
D
2.80
3.00
110.2
E
2.60
3.00
102.3
E1
1.50
1.75
59.0
e
0.95
e1
1.9
L
0.35
0.55
13.7
Mils
Typ.
37.4
74.8
Max.
57.1
5.9
51.2
19.7
7.8
118.1
118.1
68.8
21.6
9/11
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