AC0805 데이터 시트보기 (PDF) - YAGEO Corporation

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AC0805

Chip Resistor Surface Mount

YAGEO Corporation 

Chip Resistor Surface Mount AC SERIES 0402 to 2512

Product specification 8

10

TEST

Solderability

- Wetting

TEST METHOD

AEC-Q200 Test 18

J-STD-002

PROCEDURE

REQUIREMENTS

Electrical Test not required Magnification 50X

SMD conditions:

(a) Method B, aging 4 hours at 155 °C dry heat,

dipping at 235±3 °C for 5±0.5 seconds.

(b) Method B, steam aging 8 hours, dipping at

215±3 °C for 5±0.5 seconds.

(c) Method D, steam aging 8 hours, dipping at

260±3 °C for 7±0.5 seconds.

Well tinned (≥95% covered)

No visible damage

Board Flex

AEC-Q200 Test 21

AEC-Q200-005

Chips mounted on a 90mm glass epoxy resin

PCB (FR4)

Bending for 0402: 5 mm

0603/0805: 3 mm

1206 and above: 2 mm

Holding time: minimum 60 seconds

±(1.0%+0.05 Ω)

<50 mΩ for Jumper

Temperature

Coefficient of

Resistance (T.C.R.)

IEC 60115-1 4.8

At +25/–55 °C and +25/+125 °C

Refer to table 2

Formula:

T.C.R= -------R---2--–--R---1-------- ×106 (ppm/°C)

R1(t2–t1)

Where

t1=+25 °C or specified room temperature

t2=–55 °C or +125 °C test temperature

R1=resistance at reference temperature in ohms

R2=resistance at test temperature in ohms

Short Time

Overload

IEC60115-1 4.13

2.5 times of rated voltage or maximum

overload voltage whichever is less for 5 sec

at room temperature

±(1.0%+0.05 Ω)

<50 mΩ for Jumper

Feb 10, 2012 V.2

www.yageo.com

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