AT24C08D 데이터 시트보기 (PDF) - Atmel Corporation

부품명

상세내역

제조사

AT24C08D

I2C-Compatible (2-wire) Serial EEPROM 8-Kbit (1,024 x 8)

Atmel Corporation 

10. Ordering Information

Atmel Ordering Code

AT24C08D-SSHM-T(1)

AT24C08D-SSHM-B(2)

AT24C08D-XHM-T(1)

AT24C08D-XHM-B(2)

AT24C08D-MAHM-T(1)

AT24C08D-PUM(2)

AT24C08D-STUM-T(1)

AT24C08D-CUM-T(1)

AT24C08D-UUM0B-T(1)(3)

AT24C08D-WWU11M(4)

Lead Finish

Package

Voltage

Operation Range

8S1

NiPdAu

(Lead-free/Halogen-free)

8X

Matte Tin

(Lead-free/Halogen-free)

SnAgCu Ball

(Lead-free/Halogen-free)

N/A

8MA2

8P3

5TS1

8U3-1

4U-4

Wafer Sale

1.7V to 3.6V

Industrial Temperature

(–40C to 85C)

Notes: 1. T = Tape and reel:

 SOIC = 4K units per reel

 TSSOP, UDFN, SOT23, and WLCSP = 5K units per reel

2. B = Bulk

 SOIC and TSSOP = 100 units per tube

 PDIP = 50 units per tube

3. The WLCSP package is offered with a backside coating to increase product robustness.

4. For wafer sales, please contact Atmel Sales.

8S1

8X

8MA2

8P3

5TS1

8U3-1

4U-4

Package Type

8-lead, 0.15” wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8-lead, 4.40mm body, Plastic Thin Shrink Small Outline Package (TSSOP)

8-pad, 2.00mm x 3.00mm x 0.60mm body, 0.50mm Pitch, Ultra Thin Dual Flat No Lead (UDFN)

8-lead, 0.30" wide, Plastic Dual Inline Package (PDIP)

5-lead, 1.60mm body, Plastic Thin Shrink Small Outline (SOT23)

8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, Very thin Fine Ball Grid Array (VFBGA)

4-ball, 2 x 2 Grid Array, 0.40mm pitch, Wafer Level Chip Scale Package (WLCSP)

18 AT24C08D [DATASHEET]

Atmel-8880B-SEEPROM-AT24C08D-Datasheet_042014

Share Link: