MP03/260-14 데이터 시트보기 (PDF) - Dynex Semiconductor
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MP03/260-14 Datasheet PDF : 9 Pages
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MP03 XX 260 Series
ORDERING INSTRUCTIONS
Part number is made up as follows:
MP03 HB 260 - 16
MP = Pressure contact module
03 = Outline type
HB = Circuit configuration code (see "circuit options" - front page)
260 = Nominal average current rating at Tcase = 75oC
16 = VRRM/100
Examples:
MP03 HB260-10
MP03 G260-14
MP023GN260-12
Note: Preferred type is HB configuration. G & GN types are available for specific applications, only when requested.
MOUNTING RECOMMENDATIONS
Adequate heatsinking is required to maintain the base
temperature at 75oC if full rated current is to be achieved.
Power dissipation may be calculated by use of VTO and rT
information in accordance with standard formulae. We can
provide assistance with calculations or choice of heatsink
if required.
The heatsink surface must be smooth and flat; a surface
finish of N6 (32µin) and a flatness within 0.05mm (0.002")
are recommended.
Immediately prior to mounting, the heatsink surface should
be lightly scrubbed with fine emery, Scotch Brite or a mild
chemical etchant and then cleaned with a solvent to
remove oxide build up and foreign material. Care should
be taken to ensure no foreign particles remain.
An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces.
This should ideally be 0.05mm (0.002") per surface to
ensure optimum thermal performance.
After application of thermal compound, place the module
squarely over the mounting holes, (or 'T' slots) in the
heatsink. Using a torque wrench, slowly tighten the
recommended fixing bolts at each end, rotating each in turn
no more than 1/4 of a revolution at a time. Continue until the
required torque of 5Nm (44lb.ins) is reached at both ends.
It is not acceptable to fully tighten one fixing bolt before
starting to tighten the others. Such action may DAMAGE the
module.
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